Technologies of Interconnections in Electronics (TIE) – Industry-Wide Student Challenges is one of the most important student competitions in Romania dedicated to electronic engineering. Reaching its 35th edition in 2026, the TIE platform annually brings together students, academics and industry experts from technical universities in Romania and abroad.

In the 2026 edition, students of the Faculty of Electronics, Telecommunications and Information Technology of the Technical University of Cluj-Napoca achieved remarkable results:

David Csongor Molnar – 2nd Place, PCB Designer Certificate, TIEE

Andrei Gabriel Zaulet – Mention, PCB Designer Certificate, TIEE

Raul Horgoș – PCB Designer Certificate, TIEE

Alexandru Andrei Popovici – 1st Place, TIE T PLUS

Alin Tanțău – 2nd Place, TIE T PLUS

Cristescu Vlad – 2nd Place, TIE T

Soós-Györffy Bence – 2nd Place, TIEu

Octavian-Constantin Axinte – 3rd Place, TIEu

Alexandru Cimpean – Mention I, TIEu

The students were trained by Assoc. Prof. Dr. Eng. Liviu Viman and Assoc. Prof. Dr. Eng. Mihai Dărăban, academic coordinators of the Technical University of Cluj-Napoca team for the TIEE competition, Assoc. Prof. Dr. Eng. Cristian Farcas for TIE T / PLUS, and Lect. Dr. Eng. Raul Fizesan for TIEu, respectively.

Congratulations to everyone for their dedication and exceptional results! Their successes reflect the quality of the technical training offered within the Faculty of Electronics, Telecommunications and Information Technology and confirm the relevance of the collaboration between the university and the Romanian electronics industry.